| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a package of a semiconductor device for minimizing the effects of generation of stresses due to the difference in thermal expansion rates between each part of semiconductor devices, without using stress-releasing members, and for realizing durability, heat resistance, and manufacturing efficiency. SOLUTION: In this semiconductor device, a semiconductor element mounting substrate 209 having a terminal expansion rate in a temperature range, in which the semiconductor device is used which is substantially equivalent to that of a semiconductor element 201 is mounted as a stress-relaxing means between a wired tape 204 and the semiconductor element 201, and then the substrate 209 is adhered through an adhesive 210 with the wired tape 204 in the vicinity of an opening 200. Thus, effects of stresses can be prevented with this means.</p> |
