SEMICONDUCTOR STRUCTURE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To surely form very small interconnections between two boards. SOLUTION: This semiconductor structure has a first board 106 and a second board 108 bonded to the first board 106. A plurality of contacts 110, 112 are extended between the first and second boards 106, 108. A plurality of first solder bumps 114, 116 are connected between the first and second boards 106, 108 for positioning the contacts 110 to the contact pads 112.