| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a substrate for a semiconductor plastic package, in which a metallic core under a semiconductor chip mounting part and a metallic core under the surrounding circuit part are electrically insulated, and heat radiation and heat resistance after moisture absorption are made superior. SOLUTION: A metallic core under a semiconductor chip-mounting part d is formed as a ball grid array, using a flat plate metallic core or a metallic core having metallic protrusions e shaped in one-face projecting parts or both- face projecting parts in this substrate for a semiconductor plastic package. In this case, at least the metal plate part positioned directly under the semiconductor chip mounting pad is supported, by at least a holding thin metallic plate part s extended from one corner of the frame of the metal plate positioned at the outer peripheral part, so as to be electrically cut and separated from the other parts of a metal plate (a). Thus, the metallic core under the semiconductor chip can be integrated into substantially central part of the substrate without dropping.</p> |
