发明名称 SHEET FOR FIXING SEMICONDUCTOR WAFER
摘要 PROBLEM TO BE SOLVED: To protect a radiation hardening pressure sensitive adhesive layer from the outside environment including ultraviolet rays and prevent the electrification of the layer when removing a released liner, by forming the pressure sensitive adhesive layer on a base material sheet from a radiation hardening pressure sensitive adhesive, and forming the released liner on the pressure sensitive adhesive layer from a base film, a metal evaporation layer, and a release agent layer. SOLUTION: A pressure sensitive adhesive layer on a base material sheet is formed of a radiation hardening pressure sensitive adhesive, and a released liner on the pressure sensitive adhesive layer is formed from a base film, a metal evaporation layer, and a release agent layer. The release agent layer is formed on either face of a released film consisting of the base film and the metal evaporation layer. The metal evaporation layer shields the pressure sensitive adhesive layer from the light and also prevents the electrification of the pressure sensitive adhesive layer. Metal used for the metal evaporation layer is aluminum, chromium, nickel, copper, or the like. For the materials of the base film, the release agent layer, and the base material sheet, the materials already known to the public are used.
申请公布号 JP2000260735(A) 申请公布日期 2000.09.22
申请号 JP19990062475 申请日期 1999.03.10
申请人 TOYO CHEM CO LTD 发明人 UCHIDA HIROYUKI;SAIDA SEIJI;TAKATSU TOMOMICHI;WADA SHIGERU;KUME MASASHI
分类号 H01L21/304;C09J4/02;C09J7/02;(IPC1-7):H01L21/304 主分类号 H01L21/304
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