发明名称 INTEGRATED CIRCUIT
摘要 PROBLEM TO BE SOLVED: To easily secure a required number of pads for a chip area by using the pads commonly for power supplies and signals. SOLUTION: A pad 14 is connected to an internal power supply VDD via a P-channel transistor and at the same time is connected to a TEST circuit (TEG circuit) via a transmission gate, a low-level control signal and its inversion signal are inputted from a pad 11 to the transmission gate, and the same low- level control signal is inputted to the P-channel transistor for turning on and off the P-channel transistor and the transmission gate, respectively, thus connecting the pad 14 to the internal power supply VDD and causing the pad 14 to function as one for power supply. Also, a high-level control signal and its inversion signal are inputted from the pad 11 to the transmission gate), and the same high-level control signal is inputted to the P-channel transistor for turning off and on the P-channel transistor and the transmission gate, thus connecting the pad 14 to the internal circuit of the TEST circuit (TEG circuit) and causing the pad 14 to function as one for test signal.
申请公布号 JP2000260947(A) 申请公布日期 2000.09.22
申请号 JP19990065553 申请日期 1999.03.11
申请人 TOSHIBA MICROELECTRONICS CORP;TOSHIBA CORP 发明人 SHIMOJU HIROTAKA
分类号 H01L27/04;H01L21/822;H03K19/00;(IPC1-7):H01L27/04 主分类号 H01L27/04
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