Polymer stud grid array

摘要

PCT No. PCT/EP96/04407 Sec. 371 Date Apr. 16, 1998 Sec. 102(e) Date Apr. 16, 1998 PCT Filed Oct. 10, 1996 PCT Pub. No. WO97/15078 PCT Pub. Date Apr. 24, 1997In order to achieve better dissipation of the heat losses, a polymer stud grid array in proposed having an injection-molded, three-dimensional substrate (S) composed of an electrically insulating polymer, polymer studs (PS) which are arranged over the area on the underneath of the substrate (S) and are integrally formed during injection molding, external connections which are formed on the polymer studs (PS) by an end surface which can be soldered, conductor runs which are formed at least on the underneath of the substrate (S) and connect the external connections to internal connections, at least one heat sink (WL) which is partially coated during the injection molding of the substrate (S), and having at least one chip or wiring element (VE) which is arranged on the heat sink (WL) and whose connections are electrically conductively connected to the internal connections. The new configuration is suitable in particular for power components or power modules in a polymer stud grid array package.