发明名称 Integrated hybrid cooling with EMI shielding for a portable computer
摘要 A computer system includes a motherboard mounted in a chassis. An EMI shield member is mounted on the motherboard. A processor module is connected to the motherboard and has peripheral edge contact with the EMI shield member. A cap member is mounted on the processor module and is engaged with the EMI shield member. A heat sink is connected to the cap member. A heat pipe has a first end attached to the cap member and a second end attached to the heat sink. A fan is mounted in the chassis adjacent the heat sink for drawing cooling air across the heat sink.
申请公布号 US6122167(A) 申请公布日期 2000.09.19
申请号 US19980088814 申请日期 1998.06.02
申请人 DELL USA, L.P. 发明人 SMITH, RUSSELL;PENNIMAN, MARK B.;STEIGERWALD, TODD
分类号 G06F1/18;G06F1/20;H01L23/427;H05K7/20;H05K9/00;(IPC1-7):H05K5/00;H05K7/00;H05K7/14 主分类号 G06F1/18
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