发明名称 |
Integrated hybrid cooling with EMI shielding for a portable computer |
摘要 |
A computer system includes a motherboard mounted in a chassis. An EMI shield member is mounted on the motherboard. A processor module is connected to the motherboard and has peripheral edge contact with the EMI shield member. A cap member is mounted on the processor module and is engaged with the EMI shield member. A heat sink is connected to the cap member. A heat pipe has a first end attached to the cap member and a second end attached to the heat sink. A fan is mounted in the chassis adjacent the heat sink for drawing cooling air across the heat sink.
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申请公布号 |
US6122167(A) |
申请公布日期 |
2000.09.19 |
申请号 |
US19980088814 |
申请日期 |
1998.06.02 |
申请人 |
DELL USA, L.P. |
发明人 |
SMITH, RUSSELL;PENNIMAN, MARK B.;STEIGERWALD, TODD |
分类号 |
G06F1/18;G06F1/20;H01L23/427;H05K7/20;H05K9/00;(IPC1-7):H05K5/00;H05K7/00;H05K7/14 |
主分类号 |
G06F1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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