BGA PACKAGE AND FABRICATION METHOD THEREOF

摘要

PURPOSE: A ball grid array package and its manufacturing method are to reduce the number of entire process by integrating a process of attaching a solder ball with a process of manufacturing a printed circuit board. CONSTITUTION: A substrate(10) has a semiconductor chip at its one side face. An out lead(11) is formed at other side face of the substrate to be protruded therefrom. A via hole(14) is formed on the substrate having the out lead. The out lead is coated by a copper coated part(12) to electrically connect the out lead and an inner signal line of the substrate. The copper coated part is coated over an exposed part of the via hole and the out lead to electrically connect the copper coated part to the via hole directly. Then, a solder(13) is coated on the out lead to complete production of the substrate. The out lead is formed by cutting one side of the substrate vertically and then re-cutting the cut side of the substrate to form a regular hexahedron shape. Thereafter, the out lead of hexahedron shape is processed one more time to form a circular column.