SEMICONDUCTOR CHIP PACKAGE AND FABRICATION METHOD THEREOF

摘要

A semiconductor chip package and a fabrication method thereof can reduce fabrication time and cost by consecutively fabricating a semiconductor chip to the package at a wafer level. The method for fabricating the semiconductor chip package includes a step of forming the semiconductor chip having a plurality of pads at its upper portion on a wafer, a step of forming a low elastic modulus material layer 22, such as a silicone on the wafer except the pads by a spin coating process or a sputtering process, a step of forming metal patterns on the pads and the low elastic modulus material layer by a metal thin film deposition process or a photo lithography process, a step of forming a high elastic modulus material layer on the metal patterns and the low elastic modulus material layer, a step of partially exposing the upper portions of the metal patterns, and a step of boding electric media to the exposed metal patterns.