| 摘要 |
PROBLEM TO BE SOLVED: To avoid degradation of a contact property caused by unevenness, reduction or the like of elasticity of springs for moving probe needles up and down, and to avoid increase of impedance caused by interposition of the springs. SOLUTION: This probe card 11 used for measuring electrical characteristics of chips formed in a semiconductor wafer has a substrate 12 functioning as a base; and plural probe needles 14 nearly vertically erected on the lower face side of the substrate 12 corresponding to a pad arrangement of the chip, each including a tip point 14a that is a contact part to a pad. A rear end side of the probe needle 14 is formed in a bifurcately opened, nearly V-shape. Both ends of bifurcate parts 14b, 14b of the probe needle 14 are fixed to the substrate 12 by use of solder 15 and are electrically connected to wiring 13 on the substrate 12.
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