| 摘要 |
<p>The present invention provides a dual purpose workpiece handoff station (22) for intermediately staging a semiconductor wafer (21), or other workpiece, being transferred between processing stations in, for example, a Chemical-Mechanical Planarization (CMP) machine. The handoff station (22) includes a workpiece processing surface (88); such as a polishing pad or buffing pad, defining a plurality of apertures (92, 94) for applying fluid, including water, chemicals, slurry, or vacuum, to the surface of a workpiece (21). In operation, a workpiece carrier (18) moves a polished wafer (21) from a primary polishing surface (16) to the handoff station (22), and polishes, buffs, or cleans the wafer (21) in the handoff station by rotating the wafer (21) and oscillating the wafer (27) across the handoff station polishing surface (88) while pressing the wafer (21) thereon.</p> |
