| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can prevent the infiltration of moisture into its package as much as possible and the occurrence of peeling between a pad and the package. SOLUTION: A semiconductor device 1 is provided with a groove section 4A formed around a semiconductor element 5 on the semiconductor element mounting surface (a) of a pad 4, plated sections 4m which are formed only in the ground bonding areas on the semiconductor element mounting surface 4a of the pad 4, a thin wall section formed on the whole peripheral edge section of the rear surface of the pad 4, and a thin wall section formed in the connecting section with the pad 4 on the rear surfaces of support bars 6 extended from the pad 4. |
