FILM PIECE PASTING APPARATUS AND MANUFACTURE OF SEMICONDUCTOR DEVICE USING IT

摘要

PROBLEM TO BE SOLVED: To suppress occurrence of defective die bonding by preventing a bubble from being confined when a resin film stripe is pasted to a lead frame. SOLUTION: In a film piece pasting collet 1 for chucking and carrying a resin film stripe 4 and pasting it to the island 3a of a preheated lead frame 3, the film piece chucking part 6 is made of a heat resistant rubber member and a groove 6c intersecting a chuck/exhaust gas hole 6b is made in the suction face 6a continuously to the edge thereof. Since the resin film stripe 4 is chucked softly to retard deformation due to suction, entire surface of the resin film stripe 4 can be pressed even if the parallelism between the suction face 6a and the island 3a is insufficient. Consequently, a bubble is prevented from being confined between the island 3a and the resin film stripe 4.