INSPECTION DEVICE FOR BARE CHIP SINGLE BODY

摘要

PROBLEM TO BE SOLVED: To electrically inspect a semiconductor integrated circuit in a bare chip state. SOLUTION: This inspection device includes a device stage 1 for retaining a bare chip 100 by vacuum suction; and a control part 20 for controlling a height sensor 7 to measure a height of a bare chip surface located above a plane of an inspection stage 5 mounted with probes. The control part 20 controls a height of the device stage 1 according to the measured result by the height sensor 7 such that signal electrodes 101 of the bare chip 100 contact with probe needles 3, and that a desired pressure is applied to the bare chip 100.