FLEXIBLE WIRING SUBSTRATE, FILM CARRIER, TAPELIKE SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURE OF SEMICONDUCTOR DEVICE, CIRCUIT BOARD, AND ELECTRONIC DEVICE

摘要

A flexible substrate (1) comprises a long base (10) and a plurality of wiring patterns (20) formed on the base (10). The base (10) includes a plurality of first areas (44) intended for punching, and a second area (45) between adjacent ones of the first areas (44). The second area (45) includes a material forming the base (10) in the middle across the base (10), and a portion (40) that is more likely to bend lengthwise along the substrate (10) than the first areas (44).