Semiconductor device and method with improved flat surface

摘要

A semiconductor substrate has an element formation region and a scribe line region surrounding the element formation region. A metal wiring layer is formed so as to cover end portions of a plurality of interlayer insulating films over the entire periphery of the element formation region and includes cut portions at the corner of the element formation region. Then, a SOG film is formed on the entire surface of the substrate by spin coating, at that time, material of the SOG film flows out through the cut portion toward the scribe line region to prevent a SOG puddle from forming at the corner of the element formation region.