发明名称 A processing method of silicon epitaxial growth wafer and a processing apparatus thereof
摘要 <p>The present invention relates to provide a method for the preparation of silicon epitaxial growth wafer in which a planarization process by down stream type plasma etching and an epitaxial layer growing process are carried out by series, further relates to a silicon epitaxial growth wafer preparing apparatus comprising a vacuum room in which a plasma planarization chamber by plasma etching, an epitaxial layer growing chamber, a wafer aligning chamber, a wafer load lock chamber and a wafer transferring robot are contained. <IMAGE></p>
申请公布号 EP1035576(A2) 申请公布日期 2000.09.13
申请号 EP20000104406 申请日期 2000.03.02
申请人 SPEEDFAM- IPEC CO., LTD.;SUPER SILICON CRYSTAL RESEARCH INSTITUTE CORP. 发明人 YANAGISAWA, MICHIHIKO;OKAWA, SHINJI;ABE, KOZO
分类号 H01L21/302;C30B29/06;H01L21/20;H01L21/3065;(IPC1-7):H01L21/768;H01L21/310 主分类号 H01L21/302
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