发明名称 |
A processing method of silicon epitaxial growth wafer and a processing apparatus thereof |
摘要 |
<p>The present invention relates to provide a method for the preparation of silicon epitaxial growth wafer in which a planarization process by down stream type plasma etching and an epitaxial layer growing process are carried out by series, further relates to a silicon epitaxial growth wafer preparing apparatus comprising a vacuum room in which a plasma planarization chamber by plasma etching, an epitaxial layer growing chamber, a wafer aligning chamber, a wafer load lock chamber and a wafer transferring robot are contained. <IMAGE></p> |
申请公布号 |
EP1035576(A2) |
申请公布日期 |
2000.09.13 |
申请号 |
EP20000104406 |
申请日期 |
2000.03.02 |
申请人 |
SPEEDFAM- IPEC CO., LTD.;SUPER SILICON CRYSTAL RESEARCH INSTITUTE CORP. |
发明人 |
YANAGISAWA, MICHIHIKO;OKAWA, SHINJI;ABE, KOZO |
分类号 |
H01L21/302;C30B29/06;H01L21/20;H01L21/3065;(IPC1-7):H01L21/768;H01L21/310 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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