| 摘要 |
PROBLEM TO BE SOLVED: To dissolve an inconvenience by a conventional difference part in level in local soldering. SOLUTION: An outer peripheral cover body 14 is arranged on the whole periphery on the outside of a nozzle main body 12 from which melted solder is jetted through a gap 13 into which the melted solder flows down. A melted solder contact opening 16 for making the melted solder come into contact with a parts mounted substrate 15, is provided on the upper part of the outer peripheral cover body 14, and a melted solder drain port 17 for draining the melted solder is provided on a lower part. The melted solder jetted from the nozzle main body 12 comes into contact with the parts mounted substrate 15 in the melted solder contact opening 16 of the outer peripheral cover body 14, and local soldering is performed. Remaining melted solder flows down the gap 13 in the outer peripheral cover body 14 in the whole periphery on the outside of the nozzle main body 12, and it flows out to a melted solder surface 11 in a solder bath from the melted solder drain port 17 of the outer peripheral cover body 14.
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