| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device which can keep the relative speed between a polishing head and a wafer constant, give a constant pressure and uniformly polish the surface of the wafer. SOLUTION: This device is constituted in such a way that the peripheral surface of the bottom of a drum 2 and the top face of a wafer placing table 6 opposing to the peripheral surface move in the same direction, and the peripheral surface of the tip section of the drum 2 and the top face of a wafer placing table 6 opposing to the peripheral surface move in the opposite direction, and the relative speed of the rotation of a wafer W caused by the wafer placing table 6 to the speed of the rotation of a polishing pad 21 caused by the rotation of the drum 2 becomes nearly constant in the wafer W to be polished. |
