| 摘要 |
PROBLEM TO BE SOLVED: To obtain a thermoset resin composition excellent in hardenable properties and preservative, and useful in electric and electronic fields. SOLUTION: This composition consists essentially of (A) a compound having two or more epoxy groups in one molecule, (B) a compound having two or more phenolic hydroxy groups in one molecule, and (C) a compound obtained by thermally reacting (X) tetraphenylphosphonium-tetraphenyl borate with (Y) dihydroxynaphthalene within the range of the molar ratio of X:Y regulated so as to be 1:(2-4), and subjecting the product to a refluxing reaction in an alcoholic solvent.
|
