| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition containing no halogen in the composition, namely, halogen-free and imparted with sufficient flame- retardancy. SOLUTION: This resin composition comprises (A) a polyphenylene ether- based resin, (B) a halogen-free epoxy resin, (C) at least one compound selected from the group consisting of a maleimide containing at least one maleimido group in one molecule, a cyanate containing at least two cyanato groups in one molecule and an isocyanate containing at least two isocyanato groups in one molecule and (D) a phosphorus atom-containing compound. In this case, the nitrogen content is at least 1 wt.% and not more than 10 wt.% and the phosphorus content is at least 0.1 wt.% and not more than 20 wt.%.
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