| 摘要 |
PROBLEM TO BE SOLVED: To achieve a method of manufacturing a multilayer printed wiring board which exhibits superior reliability of connection between an interlayer resin insulating layer and a conductor circuit, without using a heavy metal. SOLUTION: An interlayer resin-insulating layer 50αis dried to such an extent that exposing and developing steps can be performed at an adjusted drying temperature of 70-90 deg.C, in order to prevent an interlayer resin insulating layer 50 from being crosslinked excessively. When the layer 50 is developed after exposure, the surface of the layer 50 is peeled off using a DMTG solution (step (L)). Here, since the surface of the layer 50 has been peeled off, epoxy resin particles are dissolved using permanganic acid, whereby the surface of the layer 50 can be roughened (step (K)). |
