| 摘要 |
<p>The invention improves the workability of manufacture of flip chips and provides various semiconductor devices with high reliability. A positive photosensitive resin composition containing 100 parts of polyamide by weight and 1-100 parts of photosensitive diazoquinone compound by weight is spread to a surface for device formation, patterned and hardened. The resulting polybenzooxazole resin film for device protection and the bump electrodes are used for mold semiconductor devices.</p> |
