SEMICONDUCTOR DEVICE, ITS MANUFACTURE, CIRCUIT BOARD AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To realize resin where peeling is hardly generated. SOLUTION: This device contains a semiconductor chip 10, a board 20 on which a wiring pattern is formed and resin 32 formed on the wiring pattern. In the resin 32, force generated by contraction of volume is smaller than the bonding strength to the wiring pattern when a temperature falls from a temperature exceeding a glass transition temperature to the glass transition temperature.