SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE USING IT, AND MANUFACTURE OF SEMICONDUCTOR CHIP

摘要

PROBLEM TO BE SOLVED: To improve an integration degree by utilizing a scribe line region so that, with no wire bonding, a semiconductor chip is jointed to a printed wiring board. SOLUTION: A semiconductor chip 20 is jointed face up to a surface 11 of a printed wiring board 10. A groove 25 is formed on a sidewall surface 24 of the semiconductor chip 20. In the groove 25 a conductive paste 26 is provided, and the paste 26 is connected to a connection pad P in a functional region 22 through a surface wiring 28. A solder bump 12 on the surface of the printed wiring board 10 and the connection pad P are electrically connected together through the conductive paste 26 and surface wiring 28.