| 摘要 |
PROBLEM TO BE SOLVED: To obtain a card type electronic circuit board which has high resistance to bending and twist and also has high resistance to mechanical stress applied to a semiconductor IC chip part as a point load. SOLUTION: A semiconductor IC chip 30 connected to a conductor film 20 formed on the surface of a film-shaped circuit board 10 is covered with a protective member 40. The member 40 consists of a rectangular flat plate part (42) arranged oppositely to the upper surface of the chip 30 and a bent part (44) which is provided at least on a side extending in the longitudinal side direction of the board 10 among the four sides of the part (42) and faces the side surface of the semiconductor IC chip. Further, a gap is provided between the part (44) and the film 20. |
