| 摘要 |
PROBLEM TO BE SOLVED: To perform cream soldering simultaneously with a part mounting pattern by performing cream solder printing on the surface of an earth land and then performing soldering in a reflow furnace. SOLUTION: A plurality of screw holes 1b for fastening a printed wiring board 1 mounting a surface mounting part 3 are made at corner parts and screws 4 are inserted into the screw holes 1b thus securing the printed wiring board 1 to the chassis (a), or the like, in an apparatus through a spacer 5. A ground pattern 6 is provided at a part of a circuit pattern 2 on the surface mounting part 3 side and an ground land 6a interconnected with an earth pattern 6 is provided around the screw hole 1b. A cream solder 7 is printed on the surface of the ground land 6a and soldering is performed in a reflow furnace. Since cream soldering is performed simultaneously with a part mounting patter without solder plating the earth land 6a, a printed wiring board advantageous in terms of cost is obtained.
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