The invention improves the workability of manufacture of flip chips and provides various semiconductor devices with high reliability. A positive photosensitive resin composition containing 100 parts of polyamide by weight and 1-100 parts of photosensitive diazoquinone compound by weight is spread to a surface for device formation, patterned and hardened. The resulting polybenzooxazole resin film for device protection and the bump electrodes are used for mold semiconductor devices.
申请公布号
WO0052757(A1)
申请公布日期
2000.09.08
申请号
WO2000JP01028
申请日期
2000.02.23
申请人
SUMITOMO BAKELITE COMPANY LIMITED;HIRANO, TAKASHI;YAMAMOTO, KAGEHISA;BANBA, TOSHIO;MAKABE, HIROAKI