| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent cooling water and shavings from introducing between the part floating of each semiconductor element from a semiconductor wafer on the side of the surface of the wafer and the surface of the wafer, when a plurality of the semiconductor elements are formed on the wafer and each semiconductor element is cut out by dicing. SOLUTION: A semiconductor element 20 is provided with a vibrator 21 floating from the bottom of a recessed part 20a formed in its upper surface, and at the same time, a bank 23 is formed on the peripheral edge part of the upper surface of the element 20 along the outer periphery of the element 20. The bank 23 is installed higher than at the height of the highest part of the upper part of the element 20. When the element 20 is cut out, an adhesive tape is pasted to the upper surface of the bank 23 and the tape covers the element 20. Therefore, the element 20 can be sealed with the tape. Moreover, since a semiconductor wafer is diced along the bank 23, the tape is left as it is, closely adhered to the upper surface of the bank 23 even if it is after the wafer is diced so that a state with the element 20 sealed as is can be maintained.</p> |
