| 摘要 |
PROBLEM TO BE SOLVED: To provide etching treatment equipment capable of effectively manufacturing a printed wiring board excellent in wiring density and wiring precision, and a method for etching a substrate for a printed wiring board by using the equipment. SOLUTION: In a conveyor in which a plurality of carrying roller constituted of shafts and rings larger than the diameter of the shaft are arranged in parallel, the rings fixed to adjacent carrying roles are arranged in an overlapping distance viewed from the axial direction. An etching treatment zone installed so as to cover a substrate for a printed wiring board carried by the conveyor, from above and below, is equipped with an inlet for carrying the substrate carried by the conveyor into the etching zone, an outlet for carrying out the substrate, a plurality of blow-off holes for blowing off gas from above the substrate and a plurality of sprays for spraying etching liquid against the substrate from below.
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