摘要 |
The invention relates to a method and device for baking a strip of dough (12), especially for the production of wafers, such as wafer rolls. According to the invention, a dough high in sugar content is applied to a flexible carrier strip (9), which is fed through a heated baking chamber (3) and undergoes several changes of direction, said strip being arranged in one or several tracks. The dough is baked in the baking chamber (3) and removed from said chamber on the side containing an exit. The carrier strip (9) consists preferably of a flexible plastic strip or of a plastic-coated strip with a high degree of flexibility.
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