发明名称 |
Solid state image sensor and its fabrication |
摘要 |
A dipping in potential well due to direct contact between transfer electrodes and metal wiring causes a drop in transfer efficiency through a CCD register. In order to eliminate or at least reduce the potential dipping, an N--type impurity layer that functions as a CCD channel is formed with N---type impurity regions that have impurity concentration lower than that of the N--type impurity layer. The N--type impurity regions are located below transfer electrodes in alignment with contact apertures.
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申请公布号 |
US6114718(A) |
申请公布日期 |
2000.09.05 |
申请号 |
US19980192190 |
申请日期 |
1998.11.16 |
申请人 |
NEC CORPORATION |
发明人 |
HOKARI, YASUAKI;OGAWA, CHIHIRO |
分类号 |
H01L21/339;H01L27/148;H01L29/762;(IPC1-7):H01L29/768;H01L31/023 |
主分类号 |
H01L21/339 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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