发明名称 Solid state image sensor and its fabrication
摘要 A dipping in potential well due to direct contact between transfer electrodes and metal wiring causes a drop in transfer efficiency through a CCD register. In order to eliminate or at least reduce the potential dipping, an N--type impurity layer that functions as a CCD channel is formed with N---type impurity regions that have impurity concentration lower than that of the N--type impurity layer. The N--type impurity regions are located below transfer electrodes in alignment with contact apertures.
申请公布号 US6114718(A) 申请公布日期 2000.09.05
申请号 US19980192190 申请日期 1998.11.16
申请人 NEC CORPORATION 发明人 HOKARI, YASUAKI;OGAWA, CHIHIRO
分类号 H01L21/339;H01L27/148;H01L29/762;(IPC1-7):H01L29/768;H01L31/023 主分类号 H01L21/339
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