ELECTRONIC PARTS-SEALING RESIN COMPOSITION, ITS PRODUCTION AND SEALED ELECTRONIC PARTS USING THE SEALING RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a resin composition for sealing the electronic parts made of a thermoplastic resin having excellent moisture proof reliability and moldability. SOLUTION: This resin composition comprises (A) A straight-chain type polyarylene sulfide resin, (B) an inorganic ion-exchanger, (C) one kind or two or more kinds of copolymers selected from a-b type block copolymer, a-grafted b copolymer and b-grafted a copolymer that are modified by grafting an unsaturated carboxylic acid or its derivative component (where a means atactic polystyrene, b means polybutadiene, polyisoprene, hydrogenated polybutadiene and hydrogenated polyisoprene) and (D) an inorganic filler.