METHOD FOR PLATING PACKAGE BOARD

摘要

PROBLEM TO BE SOLVED: To easily subject the circuit electrodes of a package board to stable electroplating. SOLUTION: An electrode 10 for plating comprising a metallic sheet that comes in contact with all of ball terminals 6 is brought into contact with the ball terminal 6 side of a substrate 2 constituting a package board 1 by applying pressure. Electric current is supplied to the circuit electrodes 3 of the package board 1 through the electrode 10 for plating to electroplate the circuit electrodes 3. The electrode for plating is preferably a flat platelike conductor. Since electric current is supplied to the circuit electrodes 3 through the electrode 10 for plating, all the circuit electrodes 3 are subjected to high-grade plating.