发明名称 SLURRY CIRCULATING AND SUPPLYING SYSTEM, AND POLISHING SYSTEM PROVIDED WITH THE SAME
摘要 PROBLEM TO BE SOLVED: To simplify the control of flow rate and flow pressure of the polishing slurry to be supplied to each polishing section by providing plural pumps for separately feeding the polishing slurry stored in a buffer means to each polishing section. SOLUTION: Fresh polishing slurry stored in a fresh slurry storage tank 14a is supplied to a buffer tank 26 through a pipeline 14c by a pump 14b. Polishing slurry is supplied from the buffer tank 26 to polishing sections 12a, 12b, 12c through pipelines 25a, 25b, 25c. In a recycle tank 20, the polishing slurry used in the polishing sections 12a, 12b, 12c is filtered, and fed to the buffer tank 26 through a pipeline 20f. With this structure, a pump 14 for fresh slurry supplying unit 14 always supplies the slurry to the buffer tank 26 or with a constant interval, and the complicated control is unnecessary.
申请公布号 JP2000237959(A) 申请公布日期 2000.09.05
申请号 JP19990012591 申请日期 1999.01.21
申请人 SUMITOMO METAL IND LTD 发明人 GOTO KATSUFUMI;YOSHIMITSU NOBUHIKO;IWASA YOSHINORI
分类号 B24B57/02;H01L21/304;(IPC1-7):B24B57/02 主分类号 B24B57/02
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