| 摘要 |
PURPOSE: An epoxy resin composition for sealing semi-conductor materials that is excellent in laser markability is provided. CONSTITUTION: An epoxy resin composition contains 5.0-20.0 wt.% of epoxy resin, 5.0-10.0 wt.% of phenol novolak hardening agents, 1.0 wt.% or less of hardening accelerator, 0.1-1.0 wt.% of silica surface treating agents, 70-93 wt.% of inorganic filler, 5.0 wt.% or less modifier, 0.1-3.0 wt.% of organic flame retardants, 4.0 wt.% or less of inorganic flame retardants, 1.0 wt.% or less of colouring agents, 0.1-1.0 wt.% or less of releasing agents, 0.1-2.0 wt.% of violet pigments. The resin composition is provided by mixing violet colouring pigments with conventional epoxy composition followed by kneading, cooling, crushing, and blending. |
