发明名称 WOODGRAIN PATTERN-FORMING THERMOPLASTIC RESIN COMPOSITION AND WOODGRAIN PATTERNED MOLDED PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide a woodgrain pattern-forming thermoplastic resin composition which stably yields desirable woodgrain patterns and provides a woodgrain patterned molded product having a high impact resistance and a woodgrain patterned molded product having a high weather resistance. SOLUTION: A woodgrain pattern-forming thermoplastic resin composition is prepared by mixing a base material which comprises a styrene resin added with wood meals and has an elastic modulus at 150 deg.C of within the range of from 1×107 to 1×108 dyn/cm2, and a color material in a pellet form which comprises a colorant-containing thermoplastic resin and has an elastic modulus at 150 deg.C of within the range of from 2×108 to 5×1010 dyn/cm2. Further, a woodgrain patterned molded product is prepared by coating the surface of this composition with a transparent weather-resistant resin when molding this composition.
申请公布号 JP2000239466(A) 申请公布日期 2000.09.05
申请号 JP19990047902 申请日期 1999.02.25
申请人 MITSUBISHI PLASTICS IND LTD 发明人 NOMURA YASUHIRO
分类号 B29C47/00;B29K55/00;B29K511/14;C08L25/00;C08L51/04;C08L55/02;(IPC1-7):C08L25/00 主分类号 B29C47/00
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