发明名称 |
METHOD OF TREATING A WASTED SLURRYUSED FOR POLISHING PROCESS OF OXIDE LAYER OF SEMICONDUCTOR DEVICE |
摘要 |
PURPOSE: A method for processing waste slurry is provided to recycle waste slurry used in a chemical mechanical process as a basic material for high-added products. CONSTITUTION: A method for processing waste slurry adds/gells strong acid diluted in a slurry used in a chemical mechanical process. The gelled slurry is heated/dried to form a powder. The power is used as minute particles for silica glass synthesis. The slurry consists of F-umed silica of 13-15wt% being KOH or NH4OH solution. At this time, the pH range is 10.5-11.5 and the size of silica is 130-200nm.
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申请公布号 |
KR100262525(B1) |
申请公布日期 |
2000.09.01 |
申请号 |
KR19970077458 |
申请日期 |
1997.12.29 |
申请人 |
HYUNDAI ELECTRONICS IND. CO., LTD |
发明人 |
YOU, JAE-KEUN |
分类号 |
H01L21/304;(IPC1-7):H01L21/304 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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