发明名称 METHOD OF TREATING A WASTED SLURRYUSED FOR POLISHING PROCESS OF OXIDE LAYER OF SEMICONDUCTOR DEVICE
摘要 PURPOSE: A method for processing waste slurry is provided to recycle waste slurry used in a chemical mechanical process as a basic material for high-added products. CONSTITUTION: A method for processing waste slurry adds/gells strong acid diluted in a slurry used in a chemical mechanical process. The gelled slurry is heated/dried to form a powder. The power is used as minute particles for silica glass synthesis. The slurry consists of F-umed silica of 13-15wt% being KOH or NH4OH solution. At this time, the pH range is 10.5-11.5 and the size of silica is 130-200nm.
申请公布号 KR100262525(B1) 申请公布日期 2000.09.01
申请号 KR19970077458 申请日期 1997.12.29
申请人 HYUNDAI ELECTRONICS IND. CO., LTD 发明人 YOU, JAE-KEUN
分类号 H01L21/304;(IPC1-7):H01L21/304 主分类号 H01L21/304
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