HIGH-FREQUENCY MODULE AND METHOD OF MANUFACTURE THEREOF

摘要

The invention provides a small-sized high-frequency module. To reduce the size of a high-frequency module, an integrated circuit (24) and chip capacitors (23a, 23b) connected electrically with it are placed in a recess (22), while a quartz oscillator (27) and a base (21) of substantially the same size are used. This configuration provides a small-sized high-frequency module.