| 摘要 |
PROBLEM TO BE SOLVED: To provide a coating/developing equipment in which a wafer is prevented from being artificially contaminated at extraction of a substrate from a processing line, and inspecting it. SOLUTION: Coating/developing equipment 1 provided with a development processing unit for subjecting development processing to a wafer W is provided with an inspection device 48 for detecting a defect generated in the wafer W. The carrying of the wafer W between the development processing unit and the inspection device 48 is conducted by a main carrying device 13. The inspection device 48 transmits the inspected result to a controller 49 as a detection signal, and the controller 49 which receives the detection signal controls the exposure conditions of an aligner 4 based on the presence or absence of the defect, or controls inspection frequency by adjusting a frequency adjusting mechanism 50. Since the carrying of the wafer W is conducted between the development processing unit and the inspection device 48 is conducted by the main carrying device 13, the wafer W can be prevented from being contaminated by man-made means. |
