| 摘要 |
PROBLEM TO BE SOLVED: To downsize a mold clamping device and to miniaturize a semiconductor sealing device and peripheral equipment. SOLUTION: A device has a fixed platen 12, a movable platen 14, a fixed side mold, a movable side mold, a plunger which penetrates the movable side mold, installed freely advanceably/retractably and packs a resin in a cavity space when advances, the first movement direction changing means for moving the plunger forward/backward, and the second movement direction changing means for moving the movable platen forward/backward. The first and second movement direction changing means are arranged on different axes. When the movable platen 14 is at a lower limit position of a platen stroke, the interference between the first and second movement direction changing means can be prevented.
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