发明名称 Integrated carrier ring/stiffener and method for manufacturing a flexible integrated circuit package
摘要 A carrier ring provides a stiffening function for assembling flexible circuits or semi-rigid circuits. The carrier ring is attached to a substrate adapted for attachment of a matrix of semiconductor dies. The carrier ring is provided with mold gates and mold vents for use with a transfer molding step to provide encapsulation for the semiconductor dies. Alignment and indexing marks on the carrier ring allows use of conventional assembly process flows in conventional assembly equipment. The height of the carrier ring also provides a means of providing integrated circuits with a predetermined thickness.
申请公布号 US6111324(A) 申请公布日期 2000.08.29
申请号 US19980020903 申请日期 1998.02.05
申请人 ASAT, LIMITED 发明人 SHEPPARD, ROBERT P.;COMBS, EDWARD G.
分类号 H01L21/56;H01L23/24;H01L23/31;H01L23/32;(IPC1-7):H01L23/28 主分类号 H01L21/56
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