发明名称 MANUFACTURING METHOD OF ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To restrain irregular reflection of light passing through a photomask on the surface of a photosensitive thick film by smoothing the surface of the photosensitive thick film, which is formed with a conductive paste and a dielectric paste, before exposing. SOLUTION: A photosensitive conductive thick-film paste is applied to an insulative substrate 11 and is dried to form a photosensitive conductive thick film 12. Over the photosensitive conductive thick film 12, resin which is dissolved with the same developing solution as the photosensitive conductive thick film 12 is spread, and dry it to form a resin film 21. The desirable thickness of the resin film 21 is preferably several micrometers. The resin film 21 has a smooth surface, because it compensates for the unevenness of the photosensitive conductive thick film 12 and includes no inorganic substances. Next, the resin film 21 is covered with a photomask 30 which is a negative film. For the light, it passes only through a light transmitting area 31, and enters the photosensitive conductive thick film 12 through the resin film 21 with irregular reflection restrained.
申请公布号 JP2000236157(A) 申请公布日期 2000.08.29
申请号 JP19990035352 申请日期 1999.02.15
申请人 MURATA MFG CO LTD 发明人 AMAYA KEISHIRO;KAWAGUCHI MASAHIKO;TAMEZAWA EITA
分类号 H01F41/04;H05K1/16;H05K3/02;H05K3/46;(IPC1-7):H05K3/02 主分类号 H01F41/04
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