| 摘要 |
PROBLEM TO BE SOLVED: To perform resin-sealing by transfer mold without giving damages to a wiring pattern. SOLUTION: A circuit board 52, on which a semiconductor chip 51, is mounted is held between an upper die 40 and a lower die 30 for resin sealing. On a cavity surface 41 of the upper die 40, a groove 44 which houses a wiring pattern 54a formed on the surface of the circuit board 52 is formed. Thus, even if the circuit board 52 is pinched, pressure win not be applied on the wiring pattern 54a, and damages are not produced.
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