| 发明名称 |
PREPREG, METAL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD OBTAINED FROM THESE |
| 摘要 |
<p>A prepreg obtained by impregnating a substrate with a resin composition comprising a resin, an inorganic filler in an amount of 25 vol.% or larger based on the total amount of the resin composition on a solid basis, and a silicone polymer; and a metal-clad laminate obtained by disposing a metal foil on one or both sides of either the prepreg or a laminate composed of two or more layers of the prepreg and pressing the resultant assemblage with heating.</p> |
| 申请公布号 |
WO0049070(A1) |
申请公布日期 |
2000.08.24 |
| 申请号 |
WO2000JP00891 |
申请日期 |
2000.02.17 |
| 申请人 |
HITACHI CHEMICAL CO., LTD.;TAKANO, NOZOMU;FUKUDA, TOMIO;MIYATAKE, MASATO;OSE, MASAHISA |
发明人 |
TAKANO, NOZOMU;FUKUDA, TOMIO;MIYATAKE, MASATO;OSE, MASAHISA |
| 分类号 |
C08J5/24;H05K1/03;(IPC1-7):C08J5/24;C08L83/04;C08K3/00;C08K9/06;C08L101/00 |
主分类号 |
C08J5/24 |
| 代理机构 |
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代理人 |
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