发明名称 |
Fan assisted heat sink device |
摘要 |
A fan assisted heat sink cooling device is disclosed in which the heat sink assembly also forms the housing surrounding the fan. The housing is constructed of a plurality of cooling vanes which have elongated openings therebetween allowing air to pass between and cool the vanes. The vanes are angled in an approximately opposite manner to the orientation of the fan blades in order to minimize the noise generated by the cooling device when in operation. The cooling device operates in an extremely efficient manner by causing air to pass over the cooling vanes twice. |
申请公布号 |
GB2309775(B) |
申请公布日期 |
2000.08.23 |
申请号 |
GB19960025787 |
申请日期 |
1996.12.11 |
申请人 |
* HEWLETT-PACKARD COMPANY |
发明人 |
GUY R * WAGNER |
分类号 |
F25D1/00;H01L23/36;H01L23/467;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
F25D1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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