发明名称 Mounting structure of superconducting circuit
摘要 Plural units each composed of a metallic frame and a dielectric substrate mounted on the frame are stacked on one another, thereby forming a unitary case. A superconducting circuit such as a resonator is formed on an upper surface of the substrate, and a ground plane, made of a metallic material, preferably, a superconducting material, is formed on a lower surface of the substrate. The ground plane is exposed to a center opening of the frame, so that the ground plane of one substrate faces the superconducting circuit of another substrate which is stacked underneath the one substrate with a space therebetween. Thus, a plurality of the superconducting circuits are mounted in a compact unitary case.
申请公布号 US6108214(A) 申请公布日期 2000.08.22
申请号 US19980222923 申请日期 1998.12.30
申请人 ADVANCED MOBILE TELECOMMUNICATION TECHNOLOGY, INC. 发明人 FUSE, MASASHI
分类号 H01L39/02;H01P1/00;H01P1/203;H03H9/25;H05K9/00;(IPC1-7):H05K9/00 主分类号 H01L39/02
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