发明名称 Method for fabricating a semiconductor device
摘要 A method for fabricating a semiconductor device having LDD structure. The method includes: a first step for forming an electrically insulating layer on an active area defined on a surface of a semiconductor substrate; a second step for forming a conductive layer on said insulating layer; a third step for forming a patterned photoresist layer of a downward tapered shape on said conductive layer; a fourth step for forming a gate electrode by patterning said conductive layer using a mask provided by bottom portions of said patterned photoresist layer; a fifth step for forming heavilyly doped regions at both sides of said gate electrode by introducing ions using a mask provided by top portions of said patterned photoresist layer; a sixth step for removing said patterned photoresist layer; and a seventh step for forming lightly doped regions at both sides of said gate electrode by introducing ions using a mask provided by said gate electrode.
申请公布号 US6107148(A) 申请公布日期 2000.08.22
申请号 US19980178510 申请日期 1998.10.26
申请人 NIPPON STEEL SEMICONDUCTOR CORPORATION 发明人 TAKI, MASUSHI
分类号 H01L21/266;H01L21/336;(IPC1-7):H01L21/336 主分类号 H01L21/266
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