发明名称 DEEP DRAWING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a deep drawing method of a thermoplastic resin plate extremely reduced in thickness irregularity. SOLUTION: In a deep drawing molding apparatus including a movable bottom mold, a plurality of movable side molds 4 and a clamp capable of holding the periphery of a resin plate to be stretched, when the surface area of the resin plate present inside the clamp at the start time of molding is set to S1 and the surface area of the molded product present inside the clamp after the completion of molding is set to S2 and the thickness of the resin plate before the start of molding is set to t1, the resin plate is stretched so that the thickness tb of the resin plate of the lowermost part thereof and the thickness tr of the resin plate of the lateral outermost part thereof satisfy conditions of 0.9×(t1×S1/S2)<=tb<=1.1×(t1×S1/S2) and 0.9×(t1×S1/S2)<=tr<=1.1(t1×S1/S2) to be brought into contact with the respective molds to move the molds.
申请公布号 JP2000229348(A) 申请公布日期 2000.08.22
申请号 JP19990032534 申请日期 1999.02.10
申请人 MITSUBISHI RAYON CO LTD 发明人 INOUE MASAO;SASAKI MUTSUMASA
分类号 B29C51/04;B29C51/08;B29K101/12;B29L22/00;(IPC1-7):B29C51/08 主分类号 B29C51/04
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