发明名称 RESIN SEAL MOLDING METHOD OF ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To effectively prevent imperfect sliding of a plunger by effectively preventing resin burr from depositing on the side wall surface in a pot. SOLUTION: Film wrapping resin material 16 which is heated and fused in a pot 8 is depressed against the bottom surface 10 in the pot 8 with a plunger 12. A cutting edge part (14) for breaking through a film which is installed on the pot bottom surface 10 breaks through the film 18, and a hole part 22 is formed. By pressing further the film wrapping resin material 16 with the plunger 12, fused resin material 23 is pushed out from the hole part 22 to a resin path 11, in a state such that the fused resin material 23 is not brought into contact with the pot side wall surface 9 at least by the film 18. The fused resin material 23 is infected in the upper and the lower caviies 3, 4 which are filled with the resin material.
申请公布号 JP2000232116(A) 申请公布日期 2000.08.22
申请号 JP19990032140 申请日期 1999.02.10
申请人 TOWA CORP 发明人 OSADA MICHIO
分类号 H01L21/56;B29C45/02;B29C45/14;B29L31/34;(IPC1-7):H01L21/56 主分类号 H01L21/56
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